Temperature Difference Error

¿Qué significa Diag 2 Flash 9 ?

A significant temperature difference has been detected between internal components of the terminal, such as between different processor boards or specific microcontrollers. This indicates an imbalance in heat distribution or a localized thermal issue that could affect the stability and longevity of the terminal's electronics. Unresolved, it can lead to unreliable operation or component failure.

• Localized hot spot due to component failure (e.g., shorted semiconductor, failing power component) on one part of the board, while another part remains cool.
• Uneven airflow or localized obstruction within the module or cabinet, leading to inefficient cooling of specific internal areas.
• Miscalibrated or faulty temperature sensor on one specific microcontroller (μC1 or μC2) providing incorrect readings compared to another.
• Insufficient thermal paste or improper heat sink contact on a specific processor, leading to poor heat transfer.
• Design or manufacturing defect causing abnormal heat generation or dissipation across different sections of the terminal's PCB.

Haga clic en los pasos para seguir su progreso.

1. 1

   1. Power down the terminal and visually inspect the circuit board for any signs of localized overheating (e.g., discoloration, burnt components) around microcontrollers μC1 or μC2.

2. 2

   2. Ensure uniform airflow across the terminal module by verifying no localized obstructions from adjacent components or wiring within the cabinet.

3. 3

   3. With the terminal powered on and operating (if safe), use an infrared thermometer to measure surface temperatures across different areas of the module's casing, looking for significant localized hot spots.

4. 4

   4. Verify that the terminal is operating within its specified load limits. An overloaded specific output or internal function could cause localized heating on one component.

5. 5

   5. If the issue persists despite external checks, the module likely has an internal component failure or thermal design flaw, requiring replacement of the terminal.